| 摘要 |
PROBLEM TO BE SOLVED: To achieve stable control of solder strain in a package base and a package frame in a laser module and favorable positional accuracy in an optical system composing the module. SOLUTION: In a laser module 1, a package 20 includes a plate-shaped package base 21, a cylindrical package frame 22 that is soldered and fixed to the package base 21, and a package lid 23 to which a translucent window 23a fixed to the package frame 22 is attached. Within the package 20, a hermetically-sealed laser package 10 is provided in which a plurality of laser elements 11 are fixed to the package base 21 so as to emit light toward the translucent window 23a. When the plate thickness of the package base 21 is T1 (mm) and the height of the package frame 22 is T2 (mm), T1+T2≥22 is satisfied. COPYRIGHT: (C)2007,JPO&INPIT
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