LOADING METHOD OF SOLDER BALL, INSULATING SUBSTRATE WITH SOLDER BUMP USING THE SAME, AND MODULE COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a loading method of a solder ball with which dispersion of a transfer amount of solder flux is made minimum, and an area for loading the solder balls at once is enlarged. SOLUTION: The loading method of the solder ball is provided with a process for making projections 4 of a transfer block 1 formed of an elastically deformable penetration material having the projections 4 in positions corresponding to pads 8 abut on the pads 8 of an insulating substrate 7, and attaching adhesion liquid 6 to the pads 8; and a process for loading the solder balls 2 on the pads 8 by making the solder balls 2 abut on the pads 8 to which adhesion liquid 6 is attached. COPYRIGHT: (C)2007,JPO&INPIT