发明名称 |
External contact material for external contacts of a semiconductor device and method of making the same |
摘要 |
An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.
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申请公布号 |
US2007057372(A1) |
申请公布日期 |
2007.03.15 |
申请号 |
US20060520035 |
申请日期 |
2006.09.13 |
申请人 |
BAUER MICHAEL;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD;JEREBIC SIMON;RAKOW BERND;STROBEL PETER;WOERNER HOLGER |
发明人 |
BAUER MICHAEL;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD;JEREBIC SIMON;RAKOW BERND;STROBEL PETER;WOERNER HOLGER |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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