发明名称 Lateral interposer contact design and probe card assembly
摘要 An interposer has an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of the interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of the interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.
申请公布号 US2007057685(A1) 申请公布日期 2007.03.15
申请号 US20050226568 申请日期 2005.09.14
申请人 TOUCHDOWN TECHNOLOGIES, INC. 发明人 GARABEDIAN RAFFI;TEA NIM H.;ISMAIL SALLEH
分类号 G01R31/02 主分类号 G01R31/02
代理机构 代理人
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