| 摘要 |
The present invention is related to a method for producing probes for Atomic Force Microscopy, comprising the steps of: providing a semiconductor substrate (1), producing moulds in the substrate, for the production of probe tips, producing probe configurations, each configuration comprising a contact region for attachment of a holder, and in connection with said contact region at least one set of a probe tip (3) and a cantilever (4), attaching holders (6) to said contact regions, wherein the surface area of each contact region is smaller in size than the surface area of the holder region which is to be attached to said contact region, and the method further comprises the step of releasing the structure comprising said probe configuration and said holder from the substrate by under-etching said probe configuration from the front side of the substrate, said under-etching step taking place after said step of attaching a holder. <IMAGE> |
