| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively provide an LED substrate whose heat dissipation and irradiation efficiency can be enhanced. <P>SOLUTION: In a manufacturing method of the substrate for bonding a circuit pattern 3 which has a surface of high reflection factor, and is formed of a conductive metal plate to a surface of an insulator 2 made of a resin structure having a recess 2a; low cost is realized by high heat dissipation and the circuit pattern as a reflection plate. Desired characteristics can be obtained freely, by selecting a material of resin structure and changing the area and the thickness of the circuit pattern, according to the requirement of heat dissipation and luminescence, or selecting the type of plating on the surface and changing the reflection factor. <P>COPYRIGHT: (C)2007,JPO&INPIT |
