| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for cutting off a sheet, by which apparatus and method, the posture of a cutter in cutting off can be adjusted, and also a cut-off diameter can be precisely kept to be a set value even when a cutting-off position has been changed following the adjustment of the posture, and further the cutting-off can be carried out without being restricted by a shape of cutting-off. <P>SOLUTION: The cutting-off apparatus 15 cuts off the sheet S along the outer periphery of a wafer W after the sheet S has been stuck on the wafer W arranged on a sticking table 13. The cutting-off apparatus 15 comprises a robot body 62 arranged at the side of the sticking table 13, and a cutter blade 63 supported by a tool holding chuck 69 arranged at the tip end of the robot body 62. The cutter blade 63 is dismountably mounted on the tool holding chuck 69, and is provided so as to be changed, and also can carry out the cutting-off of the sheet S along a preliminarily determined moving locus as the posture remains adjusted. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
