发明名称 FILM-FORMING COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an insulating film-forming composition that can be used for electronic device, has excellent film property such as dielectric constant, mechanical strength and has excellent heat resistance and provide insulating film by using the composition and provide electronic device including the insulating film. SOLUTION: The film-forming composition comprises a compound bearing two or more radically reactive functional groups and at least one of radical type cross-linking agent represented by formula (I) (wherein R<SB>1</SB>and R<SB>2</SB>are each independently a hydrocarbon group; Ar<SB>1</SB>and Ar<SB>2</SB>are each independently an aryl group). Further, the film-forming composition is used to provide insulating film and electronic device is given by using the insulating film. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007063471(A) 申请公布日期 2007.03.15
申请号 JP20050253525 申请日期 2005.09.01
申请人 FUJIFILM CORP 发明人 HIRAOKA HIDETOSHI
分类号 C09D4/00;C09D5/25;C09D157/00;H01L21/312;H01L21/768 主分类号 C09D4/00
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