| 发明名称 |
System in package (SIP) structure |
| 摘要 |
A System In Package (SIP) arrangement and method of connecting a plurality of flip chips and wire bond chips with reduced wiring complexity and increase flexibility. The SIP arrangement includes at least one wire bond chip and at least one flip chip.
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| 申请公布号 |
US2007057357(A1) |
申请公布日期 |
2007.03.15 |
| 申请号 |
US20050225648 |
申请日期 |
2005.09.13 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN HSIEN-WEI |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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