| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of reducing the problems of film thickness reduction in development and coloring in heat curing, and a method for manufacturing a semiconductor device using the same. <P>SOLUTION: The photosensitive resin composition contains a quinonediazidosulfonic ester of a phenol compound represented by formula (I) and a polybenzoxazole precursor, wherein R<SB>a1</SB>-R<SB>a3</SB>each independently represent alkyl, cycloalkyl, aryl, aralkyl, alkoxy, halogen, acyl, acyloxy, alkoxycarbonyl or alkenyl; R<SB>b1</SB>-R<SB>b4</SB>each independently represent alkyl, R<SB>b1</SB>and R<SB>b2</SB>, or R<SB>b3</SB>and R<SB>b4</SB>may bond to each other to form a ring; and l, m and n each independently represent an integer of 0-3. The method for manufacturing a semiconductor device using the same is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
