| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive-type radiation-sensitive resin composition that is superior in sensitivity and resolution, exhibits superior adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing the occurrence of cracks in a resin film after metal plating and push-in of plated metal into the resin film, to provide a transfer film that uses the composition, and to provide a production method that can form a metal-plating material having a thick film as bumps and wirings with high accuracy. <P>SOLUTION: The positive radiation-sensitive resin composition, for producing a metal-plating formed material, comprises (A) a polymer having a structural unit having an acid-dissociative functional group, which is dissociated by acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
