| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad that, on polishing a surface to be polished in the presence of a polishing slurry comprising an aqueous medium and abrasive grains dispersed therein, uniformizes the feed amount of the polishing slurry and increases the retained amount of the polishing slurry thereby to permit surface flatness, in-plane uniformity and uniformization of the polished amount per hour by improving wettability of the polishing pad to the polishing slurry. <P>SOLUTION: The polyurethane composition for the polishing pad comprises a urethane prepolymer bearing an ethylene oxide recurring unit in its side chain and an isocyanate group at the end of the main chain, and a chain-extending agent. A hydrophilic polishing pad having the ethylene oxide recurring unit on the surface thereof that is formed using the polyurethane composition for the polishing pad is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
