发明名称 Electroconductive paste and ceramic electronic component including electroconductive paste
摘要 For mounting on a substrate by using an electroconductive adhesive, an electroconductive paste for forming an external electrode which has improved moisture resistance and which is resistant to occurrence of external-electrode peeling, as well as a ceramic electronic component including the electroconductive paste are provided. The electroconductive paste includes a base-metal electroconductive powder, first glass frit, and an organic vehicle, wherein the first glass frit has a B<SUB>2</SUB>O<SUB>3 </SUB>content of 10 to 20 percent by mole, a SiO<SUB>2 </SUB>content of 50 to 65 percent by mole, an alkali metal oxide content of 10 to 20 percent by mole, a ZnO content of 1 to 5 percent by mole, a TiO<SUB>2 </SUB>content of 1 to 5 percent by mole, a ZrO<SUB>2 </SUB>content of 1 to 5 percent by mole, and an Al<SUB>2</SUB>O<SUB>3 </SUB>content of 1 to 5 percent by mole.
申请公布号 US2007057237(A1) 申请公布日期 2007.03.15
申请号 US20060599461 申请日期 2006.11.15
申请人 MURATA MANUFACTURING CO., LTD. 发明人 OHTANI AKIRA;UKUMA YUJI
分类号 H01B1/12 主分类号 H01B1/12
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