A CONDENSER MICROPHONE AND METHOD OF MAKING THE SAME

摘要

Disclosed are a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone. The manufacturing method comprises the steps of inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened, aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack- welding, and curing the adhesive. The metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case.