发明名称 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
摘要 <p>In a semiconductor device having a SiC substrate, a JTE layer is not substantially affected by fixed charge, so that a stable dielectric breakdown resistance can be obtained. The semiconductor device comprises a SiC epitaxial layer (2) having an n-type conductivity, an impurity layer (3) formed within the surface of the SiC epitaxial layer (2) and having a p-type conductivity, and a JTE layer (5) formed adjacently to the impurity layer (3) and having a p-type conductivity and a lower impurity concentration than that of the impurity layer (3). The JTE layer (5) is so formed as to be located a predetermined distance from the top surface of the SiC epitaxial layer (2), and a SiC region (10) having an n-type conductivity is formed above the JTE layer (5).</p>
申请公布号 WO2007029375(A1) 申请公布日期 2007.03.15
申请号 WO2006JP309307 申请日期 2006.05.09
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;TARUI, YOICHIRO;OHTSUKA, KEN-ICHI;IMAIZUMI, MASAYUKI 发明人 TARUI, YOICHIRO;OHTSUKA, KEN-ICHI;IMAIZUMI, MASAYUKI
分类号 H01L29/861;H01L21/329;H01L21/336;H01L29/06;H01L29/12;H01L29/47;H01L29/78;H01L29/872 主分类号 H01L29/861
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