| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board in which size increase due to mounting a circuit element can be prevented, and manufacturing method thereof and a circuit device. <P>SOLUTION: This circuit board 10A is provided with a recess portion 27 which is formed by partially denting the bottom surface of a semiconductor substrate 11 and can house a circuit element 28. Further, connection electrodes 16B, 16C extending from the top surface of the semiconductor substrate 11 to the inside of the recess portion 27 are formed. Thus, since the circuit element 28 can be housed in a thickness portion of the semiconductor substrate 11, the increase in size of the entire apparatus can be suppressed even when a plurality of circuit elements are mounted on the circuit board 10A. <P>COPYRIGHT: (C)2007,JPO&INPIT |
