| 摘要 |
PROBLEM TO BE SOLVED: To keep the distance securely small between a wafer and a plane, while avoiding contact with the wafer and the plane set at a predetermined temperature. SOLUTION: A blowing outlet 3a and a suction inlet 3b are formed in a plane 3c. The blowing outlet 3a has a pipe of radius Ra and length La which are exposed to a plane 3c. The suction inlet 3b has a pipe of radius Rb and length Lb exposed to the plane 3c. Here, a shape parameter Ra<SP>4</SP>/La of the blowing outlet 3a is smaller than a shape parameter Rb<SP>4</SP>/Lb of the suction inlet 3b. Under the conditions of this relation, the differential pressure in the suction inlet 3b is made smaller than the differential pressure in the blowing outlet 3a. COPYRIGHT: (C)2007,JPO&INPIT |
