| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin injection type power circuit unit, capable of favorable heat dissipation from electronic components without enlarging the case size. SOLUTION: A circuit substrate 2, mounting two or more electronic components 3 to 6 with irregular height, is accommodated in a case 1 with an opening at one end, and the circuit substrate 2, and the electronic components 3 to 6 are embedded in a resin mold 8, formed by injecting the insulating resin into the case 1. A heat sink 7, having heat dissipation fins 7c, is thermally combined with electronic components 4 and 5 with a small height measured from the plate surface of the circuit substrate 2 among the electronic components 3 to 6 mounted in the circuit substrate 2. The heat sink 7 has a part of it embedded in the insulating resin, in a state where the heat dissipation fins 7c are made to expose to the outside. COPYRIGHT: (C)2007,JPO&INPIT |
