| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser soldering method and laser soldering equipment which can avoid heat damage to a pattern. SOLUTION: A laser beam 43 is outputted from a laser oscillator 44a, and the laser beam 43 is irradiated on a land 38 and a metal terminal 35a on a stroboscope substrate 34. A solder delivery part 46 delivers solder 45 to the land 38 and the metal substrate 35a at a first speed before the temperature of the land 38 largely rises by this irradiation. Since the solder 45 is sent out so as to interrupt the laser beam 43 irradiated on the land 38, the overheat of the land 38 is suppressed. Then, the solder 45 is sent out at a second speed which corresponds to the melting rate of the solder and is lower than the first speed. When the solder 45 contacts with the land 38 and the metal terminal 35a, the solder 45 melts on the land 38 and the metal terminal 35a. The laser soldering method like this can easily avoid the heat damage of the pattern resulting from the overheat of the land 38. COPYRIGHT: (C)2007,JPO&INPIT |
