| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which can realize reduction in size while maintaining the loading area of a piezoelectric vibration element, and also to provide a manufacturing method of the same. SOLUTION: In the piezoelectric oscillator, a size of the main surface in the side of a wiring board connection of an integrated circuit element is larger than the main size of the other surface of the wiring board, a bonding material formed in the annular shape is formed at the external circumference of side surface of this wiring board, a box type cover is arranged in the manner as being engaged with the wiring board on the main surface in the wiring board side of the integrated circuit element, and a metal layer formed on the internal front surface of the cover and the side surface of the bonding material are bonded. COPYRIGHT: (C)2007,JPO&INPIT
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