| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste for a semiconductor which is excellent in the adhesion strength at a high temperature and has a low modulus of elasticity under elevated temperatures, and is free from the detachment of the semiconductor resin paste layer or the erosion of a wiring in a semiconductor element in solder crack resistance and moisture resistance tests. SOLUTION: The resin paste for a semiconductor contains essential components of (A) an epoxy resin, (B) a curing agent and (C) a filler, wherein the epoxy resin contains 5 weight parts or over of a compound shown by a general formula (1), with 1,000 ppm or less of a hydrolyzable chlorine content, wherein R1 may be the same or different and represents a hydrogen atom or a 1-6C alkyl group and n is a positive number of 0-3, in average. COPYRIGHT: (C)2007,JPO&INPIT
|
