发明名称 Electronic apparatus and thermal dissipating module thereof
摘要 A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.
申请公布号 US2007058347(A1) 申请公布日期 2007.03.15
申请号 US20060407094 申请日期 2006.04.20
申请人 VIA TECHNOLOGIES, INC. 发明人 TSAI KUO-YING;KU SHIH-CHANG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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