| 摘要 |
The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof. |
| 申请人 |
BASF AKTIENGESELLSCHAFT;SCHNEIDER, NORBERT;LIPPERT, GERALD;LOCHTMAN, RENE;MAAS, HEIKO;PFISTER, JUERGEN;SOBOTKA, BETTINA;WAGNER, NORBERT |
发明人 |
SCHNEIDER, NORBERT;LIPPERT, GERALD;LOCHTMAN, RENE;MAAS, HEIKO;PFISTER, JUERGEN;SOBOTKA, BETTINA;WAGNER, NORBERT |
