Thermoden unit for joining and or electrically contacting many semiconductor elements with a common substrate or second element by warming adhesive under pressure has movable heating head and two heating plates

摘要

A thermoden unit comprises a movable heating head to press semiconductor and substrate together while warming. A heating plate simultaneously warms all the substrate elements (3) on the upper side (3a) and has heat-resistant paper (7) or film between the elements and plate. On the underside (2a) of the carrier substrate is a second heating plate (5) at least as large as the first that simultaneously warms the substrate in the region of the semiconductor elements.