| 摘要 |
A laser cutting method capable of reducing the cutting time accordingly by increasing the cutting speed while reducing the size of a substrate to be cut is provided. A laser cutting method comprises: a first step of dividing a substrate at a first cutting speed; a second step of dividing the substrate at a second cutting speed faster than the first cutting speed after cutting the substrate in the first step; and a third step of dividing the substrate at a third cutting speed faster than the second cutting speed after cutting the substrate in the second step. When the substrate is cut continuously, and a post-cutting speed is faster than a pre-cutting speed. The first step is performed by dividing the substrate into two equal parts of the substrate. Each of the two parts of the substrate is divided into different two parts of the substrate at the second cutting speed in the second step. The substrate is divided into 1/(2^n) in the respective corresponding steps, where n is 1, 2, 3, ..., n.
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