发明名称 MICROCAPSULE FOR ULTRASONIC DESTRUCTION AND PROCESS FOR PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a microcapsule that makes it possible to easily be destructed by the irradiation of an ultrasonic wave and positively make an encapsulated substance release to the outside. <P>SOLUTION: The microcapsule encapsulates a gas and a liquid and/or a solid in the inside of a protective outer wall, wherein the protective outer wall is composed of a copolymer comprising acrylic components, particularly an ethylene glycol and an acrylonitrile as the repeating units and as the encapsulated substance is used a leuco dyestuff dissolved in an oil as a high boiling point solvent, a pharmaceutically active ingredient, an adhesive component or the like. The microcapsule is destructed by the action of an ultrasonic wave on the microcapsule, to thereby make the encapsulated substance release from the microcapsule. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007063405(A) 申请公布日期 2007.03.15
申请号 JP20050251223 申请日期 2005.08.31
申请人 CASIO ELECTRONICS CO LTD;CASIO COMPUT CO LTD;KOBE UNIV 发明人 OKUBO MASAYOSHI;MINAMI HIDETO;KAMOSHITA YASUO
分类号 C08F220/20;A61K9/50;B01J13/14;B41M5/00;C08F220/44 主分类号 C08F220/20
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