| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board with which double-sided conductive metal layers are surely conducted in a double-sided circuit board and further, a cross-sectional shape of circuit wiring is not made worse. SOLUTION: In a method of manufacturing a circuit board including a conduction structure formed from a through-hole or a bottomed via-hole, a conductive material 4 is given by forming a conduction hole 3 on a double-sided metal-clad laminate including conductive metal layers 2 on both sides of an insulating base 1, a plating resist film 9 is formed excepting for said conduction hole 3 and a land 5 thereof, the plating resist film 9 is released and removed after conducting the conductive metal layers 2 and forming a circuit wiring pattern 10 by plating, and the circuit wiring pattern 10 is formed by removing the exposed conductive metal layers 2 and electrically separating the circuit wiring pattern 10. The step of forming a plating layer for conduction between the double-coated conductive layers and the step of forming a plating layer for circuit wiring formation are performed separately from each other. COPYRIGHT: (C)2007,JPO&INPIT
|
