| 摘要 |
PROBLEM TO BE SOLVED: To provide devices which so cut down the overhead time of a heating apparatus as to improve its throughput, and reduce the sticking amount of particles to a substrate, in the heating apparatus having hot plates and a cooling plate. SOLUTION: The heating apparatus 2 has a flat heating chamber 4 provided in a housing and for heating a wafer W of a substrate on whose one side an opening is provided for carrying the wafer W thereinto/therefrom, hot plates 44, 45 so provided in the heating chamber 4 as to heat the wafer W from its upside and downside, a cooling plate 3 so provided as to adjoin to the side of the opening of the heating chamber 4 for cooling the wafer W heated by the hot plates 44, 45, and a carrying means provided in the housing for so carrying the wafer W between the upside position of the cooling plate 3 and the inside of the heating chamber 4 as to perform the heat treatment of the substrate in the heating chamber 4 in the state of holding the wafer W. COPYRIGHT: (C)2007,JPO&INPIT
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