发明名称 MANUFACTURING METHOD OF SUBSTRATE WITH HIGH-FREQUENCY-USE RESISTOR, AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve the problem that in the conventional substrate, as a resistor is formed by electroless plating, nickel must be used as the material for the resistor, and when a nickel film is formed by electroless plating, the reproducibility is degraded by the variation of the grain diameter of deposited nickel according to the temperature condition, the plating time, and the nickel concentration, so that it is difficult to always manufacture the resistors having the same resistance value. SOLUTION: This manufacturing method of a substrate with a high-frequency-use resistor comprises the steps of forming a resistor film 4 by a means of vapor deposition or sputtering etc. of a thin film resistor material at least on one surface of a conductive material 5 such as copper etc., laminating a substrate 1 of an insulating material on the conductive material having the resistor film formed thereon, forming a circuit pattern by removing the resistor film and the conductive film with an etching means, and forming a resistor in the circuit by removing the conductive film in the circuit portion which needs the resistor in the circuit pattern with an etching means. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007067138(A) 申请公布日期 2007.03.15
申请号 JP20050250709 申请日期 2005.08.31
申请人 EITO KOGYO:KK 发明人 SEKIMOTO RIICHI;TAKAHASHI TATSUMI;ITO JUNICHI
分类号 H05K1/16;H01L23/12 主分类号 H05K1/16
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