| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device including a resistor and a capacitor. SOLUTION: The semiconductor device has a semiconductor substrate (100), a first resistor element (103) arranged on the semiconductor substrate, a capacitance element (120) arranged so as to be superposed above the first resistor element, and an insulating film (105) arranged between the first resistor element and the capacitance element. COPYRIGHT: (C)2007,JPO&INPIT
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