| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein, when a high-frequency module 23 is mounted to a mother board, the occupation area of the high-frequency module 23 is large in the mother board. SOLUTION: The high-frequency module is provided with a backside component 61 attached to the backside 53 of a circuit board 49, a terminal line board 69 arranged surrounding the backside component 61, a hole 75 made at the center of the terminal line board 69, and a backside cover 77 made of metal that is engaged with the hole 75. The backside cover 77 is provided with a top surface 81 covering the backside component 61 and a side plate 83 formed by being bent from the top surface 81, and the side plate 83 is inserted between the backside component 61 and the inner circumferential side surface of the hole 75. Thus, a high-frequency circuit can be also formed on the backside 53 of the circuit board 49, so that the high-frequency module 23 can be made small in area. COPYRIGHT: (C)2007,JPO&INPIT
|
