| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible laminated board cladded with a copper layer on a single site totally made of polyimide superior in a heat resistivity and transparency of a polyimide layer, which is preferably used for mounting electronic members or the like comprised of a flexible wiring board, a semiconductor package, a TAB structure or a COF structure, and also to provide a manufacturing method of it. SOLUTION: The a flexible laminated board cladded with copper layer on a single site is made by laminating a copper foil on one side of a heat resistant polyimide film through a heat resistant polyimide adhesive layer, and the heat resistant polyimide adhesive layer has a glass transition temperature not lower than 350°C, the heat resistant polyimide film for use has a thermal expansion coefficient of not higher than 20 ppm/°C and a surface roughness Ra of a laminated face of the copper foil is not larger than 0.2μm. COPYRIGHT: (C)2007,JPO&INPIT |
