发明名称 BARREL PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a barrel plating apparatus which inhibits a not-yet-plated portion from being formed, by efficiently circulating a plating solution in a barrel without complicating a structure in the barrel and consequently alleviating or preventing an article to be plated from unevenly distributed or staying in the barrel, thereby reliably forms a plated film having a uniform thickness on the article to be plated. SOLUTION: The barrel plating apparatus has: a plating tank 1 filled with a plating solution 2; a positive electrode, a negative electrode and the barrel 3 for accommodating the article to be plated, which are immersed in the plating tank 1; and a plating solution circulation mechanism provided with a duct for supplying and draining water so as to circulate the plating solution 2 inside and outside the barrel 3. The duct for supplying and draining the water forms an electroconductive liquid duct 9 by being integrated with the negative electrode. Therefore, the barrel plating apparatus can prevent the plating solution 2 from decreasing the concentration in the barrel 3 and uniformize the thickness of the plated film. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007063622(A) 申请公布日期 2007.03.15
申请号 JP20050251386 申请日期 2005.08.31
申请人 NEC TOKIN CORP 发明人 ABE RYUZO
分类号 C25D17/20 主分类号 C25D17/20
代理机构 代理人
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