| 摘要 |
Methods and apparatus are provided for a cooling system ( 100 ) for cooling a microelectronic device ( 102 ). The system includes a heat sink ( 104 ) and first and second heat pipes ( 106, 108 ). The heat sink ( 104 ) has a top side ( 114 ) and a bottom side ( 116 ). The top side ( 114 ) is coupled to the microelectronic device ( 102 ). The first and second heat pipes ( 106, 108 ) are embedded in the heat sink ( 104 ). The first heat pipe ( 106 ) is disposed along a first line ( 118 ). The second heat pipe ( 108 ) is disposed along a second line ( 120 ) that is not parallel to the first line ( 118 ) and each of the first and second heat pipes ( 106, 108 ) includes a portion located beneath the microelectronic device ( 102 ).
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