CAPACITOR-EQUIPPED SEMICONDUCTOR DEVICE

摘要

A capacitor-equipped semiconductor device includes: a semiconductor chip (12) having a plurality of electrode terminals (16, 18); a sheet-shaped substrate (20) having at least a film-shaped capacitor; and a mounting substrate (32) having chip connection terminals (36a, 36b) arranged to correspond to the electrode terminals (16, 18) of the semiconductor chip (12) and a ground terminal (36c) arranged to correspond to one (28c) of the electrodes of the film-shaped capacitor of the sheet-shaped substrate (20) on one surface,and an external connection terminal connected to the chip connection terminals (36a, 36b) and a ground terminal (36c) for mounting on an external substrate on the other surface.