Verfahren und Vorrichtung zum Zerteilen eines Wafers und zum Trennen von Bauelementen

摘要

A method of die bonding electronic components in which a wafer (14) is mounted on a dicing tape (17) which comprises at least one layer of shrink film (21) and a pressure sensitive adhesive layer (22). The wafer is stuck to the pressure sensitive adhesive layer and diced into chips (16). The dicing tape (17) is then heated to cause the area of adhesion to shrink and to thereby decrease the adhesive strength between the chips and the adhesive layer. The chips (16), which are arranged at predetermined spacings, are then sucked one at a time by a suction collet (19) disposed above the chips to separate them from each other. The invention also provides an apparatus therefor. This method enables effective die bonding without damaging the chips.