发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photosensitive resin composition comprising 100 parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more aromatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.</p>
申请公布号 WO2007029614(A1) 申请公布日期 2007.03.15
申请号 WO2006JP317325 申请日期 2006.09.01
申请人 ASAHI KASEI EMD CORPORATION;PI R & D CO., LTD.;KANADA, TAKAYUKI;HANAHATA, HIROYUKI;JIN, XINGZHOU;WAKI, SHUZO 发明人 KANADA, TAKAYUKI;HANAHATA, HIROYUKI;JIN, XINGZHOU;WAKI, SHUZO
分类号 H01L21/027;G03F7/023;G03F7/022;G03F7/40 主分类号 H01L21/027
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