| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating/cooling device in which a footprint of a thermal treatment unit is prevented, and which deals with upsizing of an FPD substrate without using a carrying robot. SOLUTION: In the heating/cooling device with a substrate G mounted, a palette P mounted with the substrate G is raised at a specified speed in a heating process chamber 38 by a belt driving mechanism of an elevator. The substrate G is heated by spending a specified time in a process for rising in the heating process chamber 38. When the palette P reaches the top of the heating process chamber 38, the palette is carried from the palette support of the elevator through an upper opening 80a of a partitioning wall 80 to a palette support at the uppermost level of the belt driving mechanism of the elevator of a cooling process chamber 39. Then the palette is cooled while coming down at a predetermined speed in the cooling process chamber 39 by the belt driving mechanism of the elevator. COPYRIGHT: (C)2007,JPO&INPIT
|
