| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip capable of applying an adhesive with a comparatively simple method, and to provide its manufacturing method. SOLUTION: An IC chip wafer includes a heat-seal layer on a circuit surface and an electrode surface. The IC chip is obtained by dicing the IC chip wafer, and performing division into an individual IC unit, having a flat heat seal layer on the surface. When the IC chip is mounted, there is no need for the adhesive to be previously applied at the prescribed position of an IC tag antenna terminal or a BGA wiring substrate terminal, etc. COPYRIGHT: (C)2007,JPO&INPIT
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