| 摘要 |
PROBLEM TO BE SOLVED: To achieve a thick film of a wiring layer, while suppressing an increase of a wiring spacing of a circuit board. SOLUTION: A method of manufacturing the circuit board comprises the steps of sequentially laminating a lower layer conductive film 2 and an upper layer conductive layer 3 on a base material 1, setting that the etching rate of the lower layer conductive film 2 is larger than the etching rate of the upper layer conductive film 3, forming an upper layer wiring layer 3a by etching the upper layer conductive film 3 while using a resist pattern 4 as a mask, furthermore forming a lower layer wiring layer 2a by etching the lower layer conductive film 2 while using the resist pattern 4 as the mask, and forming a wiring pattern on which the upper layer wiring layer 3a is laminated on the lower layer wiring layer 2a. COPYRIGHT: (C)2007,JPO&INPIT
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