| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of efficiently and inexpensively manufacturing a wiring board having a through conductor wiring. SOLUTION: This method has a substrate preparing process of preparing a substrate in which at least a substrate surface and a through hole internal surface are made of an insulator; conductive supporter preparing process of preparing a conductive supporter; photoresist layer forming process of forming a photoresist layer on the one side surface of the substrate or the conductive supporter; exposure processing process of executing exposure processing for the photoresist layer; substrate-conductive supporter joining process of joining the substrate and the conductive supporter via the photoresist layer; conductive supporter exposing process of executing development processing and removing the photoresist layer positioned on the lower side of a through hole opening of the substrate to expose one part of the conductive supporter; and metal film forming process of forming a metal film on the through hole by an electroplating method using the conductive supporter as a cathode. COPYRIGHT: (C)2007,JPO&INPIT
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