Method and device for filling zones situated in hollows or between tracks with a viscous product on a printed circuit board and apparatus using such a device

摘要

The invention relates to a method and device for filling areas located in hollows ( 4 ) which do not open out onto the surface of a substrate ( 1 ) without a mask or silk screen. According to the invention, said method consists in associating the following objects according to the order of the direction of relative displacement of a head ( 12 ) of a filling product ( 2 ) in relation to the substrate ( 1 ) i.e. a spreading element ( 10 ) for the product to be filled ( 2 ) on the surface of the substrate ( 1 ); an element for displacing ( 3 ) the filling product ( 2 ) in the area to be filled ( 4 ); an element ( 7 ) for adjusting the thickness or raking off the excess filling product ( 2 ) such that the above-mentioned filling product ( 2 ) remains constantly in contact with the area to be filled ( 4 ) from the beginning of the filling operation until raking off of the excess product.