| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump wire which can be continuously bonded by preventing backlash thereof when it is pull-cut, and also to provide a cutting method of a bonding wire. <P>SOLUTION: In this method of cutting the bump wire, the bump wire is pulled upward from a molten ball joined to a joining conductor and is broken at the timing of the opening and closing operation of a wire clamper. By pulling the bump wire upward (by a little amount) after the molten ball is jointed to the joining conductor, a narrow-diameter portion is formed in the bump wire. The wire clamper is opened once then is closed, and the bump wire is pulled again (this time, with force) to cut the bump wire from the narrow-diameter portion. When cutting the bonding wire after second-bond joining, the same method is used. <P>COPYRIGHT: (C)2007,JPO&INPIT |
