| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable to realize junction of metal terminals with large junction strength without requiring a long time. <P>SOLUTION: A metal terminal 2a of a first electronic component and a metal terminal 2b of a second electronic component are oppositely placed, metal ultra-fine particles 3 having the same quality as that of the metal terminals are arranged between the opposite metal terminals, and an oxide film is reduced and baked to obtain an electronic component aggregation having a junction portion for joining the metal terminals. In a preferred embodiment, metal terminals made of copper are joined with metal ultra-fine particles made of copper or copper alloy. <P>COPYRIGHT: (C)2007,JPO&INPIT |
