| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump structure in which its installation position, shape and size are well controlled, and to provide a manufacturing method thereof. <P>SOLUTION: This bump structure 100 includes a projection portion 10 provided on an insulation layer 20 and made of a resin obtained by curing a liquid material, and a conductive layer 30 for covering the projection portion 10. The projection portion 10 is obtained by forming a liquid repelling portion 40 having a liquid repelling property to a liquid material and a hydrophilic portion 42 having higher wettability to the liquid material than that of the liquid repelling portion 40 on an upper face 20a of an insulation layer 20, and after that, spraying the liquid material to the hydrophilic portion 42 and curing the liquid material. <P>COPYRIGHT: (C)2007,JPO&INPIT |
