| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small power semiconductor element having significantly improved cooling performance and excellent in reliability and manufacturability, and to provide a semiconductor power converter. <P>SOLUTION: The power semiconductor element is provided with a plurality of semiconductor chips 106; a first conductor 13 joined to the anode sides of a plurality of the semiconductor chips 106; a second conductor 14 joined to the cathode sides of a plurality of the semiconductor chips 106; a heat-dissipating means 11 which is adhered to the first/second conductors 13, 14 on a face non-parallel to each joining face between a plurality of the semiconductor chips 106 and the first conductor 13, and to each joining face between a plurality of the semiconductor chips 106 and the second conductor 14, and dissipates heat of a plurality of the semiconductor chips 106; and a sheet-like insulator 12 made of an inorganic/organic hybrid material and provided on the adhering face between the first/second conductors 13, 14 and the heat-dissipating means 11. <P>COPYRIGHT: (C)2007,JPO&INPIT |
