| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a mounting method thereof by which, even if the electronic component is comparatively large, it can be stably mounted to a substrate. <P>SOLUTION: The electronic component 100 is provided with a lead 2 to be inserted into a lead insertion hole 3 formed in a substrate 200. In this case, the lead 2 is comprised of a main body 20 made of conductive material and a tip 21 made of solder, and a diameter of the tip 21 is the same as or smaller than that of the main body 20. <P>COPYRIGHT: (C)2007,JPO&INPIT |
