METHOD OF BONDING SUBSTRATE TO ELEMENT USING Au-Sn ALLOY SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a method of bonding especially such an element that the long time heating is not preferable, e.g., an LED (light emitting diode) element to a substrate by using an Au-Sn alloy solder paste. SOLUTION: The method of bonding a substrate to an element comprises a step of: reflowing an Au-Sn alloy solder paste mounted or coated on a substrate in a non-oxidative atmosphere; cleaning the flux residues of the reflowed Au-Sn alloy solder paste to form a solidified Au-Sn alloy solder layer on the substrate surface; reflowing the solidified Au-Sn alloy solder layer on the substrate surface in a non-oxidative atmosphere to remelt it, forming a molten Au-Sn alloy solder layer on the substrate surface, and mounting the element on the molten Au-Sn alloy solder layer to bond the substrate to the element. COPYRIGHT: (C)2007,JPO&INPIT