METHOD FOR MANUFACTURING DIE FOR FORMING SUBSTRATE OF MICROCHIP AND METHOD FOR MANUFACTURING SUBSTRATE OF MICROCHIP USING THE DIE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a die for forming a substrate of a microchip which has a flow path having an accurate dimension and can be made at a low cost, and a method for manufacturing the substrate of the microchip using the die. SOLUTION: The method for manufacturing the die for forming the substrate of the microchip having recessed portions comprises the steps of: fixing a photosensitive organic film on a flat supporting plate; exposing the photosensitive organic film through a photomask having a required recessed portions pattern to be formed on the substrate of the microchip; developing the exposed photosensitive organic film; forming a conductive thin film on the surface of the developed photosensitive organic film and on an exposed region of the supporting plate in case the region of the supporting plate exposed by developing exists; forming a metal plate on the conductive thin film by electroplating so that the conductive thin film becomes one of electrodes; and peeling the conductive thin film and the photosensitive organic film from the obtained metal plate. COPYRIGHT: (C)2007,JPO&INPIT