发明名称 MOLD APPARATUS FOR ON-CHIP LENS, METHOD FOR MANUFACTURING MOLD APPARATUS FOR ON-CHIP LENS AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a mold for forming an on-chip lens capable of materializing the highly accurate registration in light condensation and to provide a solid-state image pickup element having high light condensation efficiency using the mold for forming the on-chip lens. SOLUTION: The mold apparatus for forming an on-chip lens is provided with the wall parts 102 that are installed so as to rise in the areas between each lens in accordance with the lens surface forming pitch of the on-chip lens, substrates 104 that are installed on the upper layers of the wall parts and have concave surfaces having a desired curvature in each area enclosed by the wall parts, and a coating layer 105 that is formed so as to cover the concave surfaces of the substrates. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007062191(A) 申请公布日期 2007.03.15
申请号 JP20050252112 申请日期 2005.08.31
申请人 FUJIFILM CORP 发明人 KORIYAMA HIDEKI
分类号 B29C33/38;B29C33/42;B29L11/00;G02B3/00;H01L27/14 主分类号 B29C33/38
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